1 / 4 www.asb.co.kr august 2009 p lerow tm aln1954 internally matched lna module the plerow tm a ln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- ca tion terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable i mplementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass produc tion level. parameter unit specifications min typ max frequency range mhz 1920 1980 gain db 25.5 26.5 gain flatness db ? 0.15 ? 0.2 noise figure db 0.65 0.7 output ip3 dbm 36.5 38 s11 / s22 db - 18 / - 15 output p1db dbm 19 20 switching time (3) ? sec - supply current ma 170 190 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 29 ~ 31 (before fail) package type & size mm surface mount type, 13wx13lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured wi th two tones at an output power of 7 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to v s . pin number function 3 rf in 8 rf out 10 v s other s ground ou t line drawing (unit: mm) feature s s 21 = 26.65 db @ 1920 mhz = 26.35 db @ 1980 mhz nf of 0.65 db o ver fr e quency unconditionally stable single 5v supply high oip3 @ low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all g round pins for better rf and thermal performance, as shown in the dra w ing at the left side. description aln1954 asb inc. (top view) (bottom view) solder stencil area ? 0.4 plated thru holes to ground pl ane plerow (side view) (recommended footprint) c o u pl er website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion c o u pl er c o u pl er c o u pl er c o u pl er 2 - stage single type specifications (in pr o duction) typ. @ t = 25 ? c, v s = 5 v, freq. = 1950 mhz, z o.sys = 50 ohm
2 / 4 www.asb.co.kr august 2009 p lerow tm aln1954 internally matched lna module s - param e ters noise figure oip3 p1db 1920~1980 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 4 www.asb.co.kr august 2009 p lerow tm aln1954 internally matched lna module 1. s - parameter 2. oip3, p1db & nf note: tested at room temperature. 1. s - parameter 2. oip3, p1db & nf note: tested at v s = 5 v . 1920 mhz 1950 mhz 1980 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (d b) s21 (db) s11 (db) s22 (db) 4.50 v 26.75 - 23.01 - 19.60 26.62 0.25 - 24.79 - 17.82 26.50 - 25.74 - 17.27 4.75 v 26.80 - 23.22 - 20.33 26.67 0.25 - 25.36 - 18.38 26.55 - 25.94 - 17.69 5.00 v 26.81 - 23.40 - 20.70 26.69 0.24 - 25.91 - 18.83 26.57 - 27.95 - 18.12 5.25 v 26.87 - 23.55 - 23.55 26.74 0.25 - 26.15 - 19.41 26.62 - 29.25 - 18.54 5.50 v 26.88 - 23.61 - 23.61 26.75 0.25 - 26.50 - 19.91 26.63 - 30.12 - 19.04 1920 mhz 1950 mhz 1980 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) 4.50 v 36.41 20.06 0.587 36.20 20.30 0.603 36.52 20.34 0.610 4.75 v 37.18 20.79 0.610 37.05 20.76 0.610 37.43 20.82 0.619 5.00 v 38.04 21.25 0.612 38.07 21.23 0.613 38.18 21.26 0.621 5.25 v 38.92 21.66 0.641 38.74 21.63 0.655 39.28 21.66 0.660 5.50 v 39.18 22.04 0.659 38.86 22.01 0.680 39.30 22.04 0.684 1920 mhz 1950 mhz 1980 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) - 45 ? c 27.78 - 20.71 - 24.90 27.66 0.24 - 21.81 - 23.85 27.54 - 27.46 - 21.49 - 10 ? c 27.63 - 22.51 - 23.41 27.47 0.27 - 23.77 - 21.60 27.36 - 29.16 - 19.01 25 ? c 27.24 - 23.21 - 22.52 27.13 0.27 - 24.59 - 19.94 26.97 - 28.51 - 18.19 60 ? c 27.07 - 24.04 - 21.20 26.93 0.30 - 2 4.73 - 19.10 26.77 - 27.43 - 17.35 85 ? c 26.86 - 24.79 - 20.58 26.72 0.29 - 24.75 - 18.78 26.57 - 26.58 - 16.68 1920 mhz 1950 mhz 1980 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) - 45 ? c 40.50 2 1.93 0.318 39.40 22.37 0.246 40.70 22.40 0.345 - 10 ? c 38.50 21.88 0.523 38.75 22.35 0.542 39.50 22.31 0.512 25 ? c 38.18 21.16 0.629 38.15 21.52 0.630 38.40 21.69 0.611 60 ? c 37.90 21.11 0.922 37.15 21.49 0.925 39.85 21.64 0.961 85 ? c 36.75 20.83 1.118 36.90 20.81 1.112 38.25 21.42 1.157 rf performance with operating temperature rf performance with voltage change
4 / 4 www.asb.co.kr august 2009 p lerow tm aln1954 internally matched lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be deter mined by customer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical performance . 2) dc blocking capacitors are always necessarily placed at the input and out put port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are inclu d- ed inside the aln module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e- quency. application circuit recommended soldering reflow process + - aln out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor 20~4 0 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) in out vs size 25x25mm (for aln series C 13x13mm) evaluation board layout
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